An accelerator based on substituted urea which has been employed in thermosetting epoxy. Experiments reveal a highly latent character, specifically in combination with dicyandiamide (i.e. micronized-Dycure). For instance, liquid bisphenol A epoxy resins in formulation with micronized dicyandiamide and Dycure U700-23 offers an excellent combination. Optimal ratio depends on the particular application and process needs, to be verified independently for every case. Dycure U700-23 is soluble in water and can be used as a desired accelerator for waterborne epoxy dispersions applications, including waterborne prepregs for all types of laminates. Dycure U700-23 latency is a preferred accelerator for storage stable one component formulations.The accelerator shows an exceptional balance between reactivity and prolonged latency, making it an excellent accelerator to activate dicyandiamide curing agent in different one component thermosetting epoxy resin formulations, for adhesives as well as structural performance. |
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