Widely used as a latent accelerator in thermosetting epoxy resin formulations, its use is particularly suited in combination with micronized dicyandiamide [Dycure 8]. Dycure U300-12AB contains anti-caking agent to minimize agglomeration during storage. All examples given in this datasheet are based on Dycure U300-12 but can be taken as representative for Dycure U300-12AB as well. They are widely used as an accelerator to activate dicyandiamide curing agents in various single component thermosetting epoxy resin formulations for: • Composites based on prepregs e.g., in the sporting goods industry • Adhesives for structural applications • Encapsulation compounds in the electronic industry |
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