Epoxy resins are one of the most applied thermosets in coatings applications. The curing agent employed in the crosslinking process defines not only the final properties of the thermosets but also the technological conditions of application. Latent curing agents simplify the technological curing process because they allow the preparation of one-pot curing mixtures. An aromatic backboned dihydrazide, it is commonly used as a curing agent for epoxy resins in one-component formulations. Experiments reveals that this hardener exhibits a high glass transition temperature, high resistance to acid and provides cure above 160°C. To decrease the curing temperature, Dycure IDH can be utilized with accelerators to increase reactivity. Some recommended accelerators for Dycure IDH include substituted ureas such as Dycure U300, Dycure U500-21, and Dycure U700-22. These accelerators reduce the activation temperature of Dycure IDH without any adverse impact on performance properties. Dycure IDH typically has been employed in one-component adhesives and hot-melt prepregs due to the high Tg, excellent toughness and high acid resistance properties. Micronized grade of Dycure IDH is available as Dycure IDH–M. |
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